ZHCSGP3D September   2017  – December 2018 OPA2837 , OPA837

PRODUCTION DATA.  

  1. 特性
  2. 应用
    1.     具有真正接地输入和输出范围的低功耗、低噪声、精密单端 SAR ADC 驱动器
  3. 说明
    1.     Device Images
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information: OPA837
    5. 6.5  Thermal Information: OPA2837
    6. 6.6  Electrical Characteristics: VS = 5 V
    7. 6.7  Electrical Characteristics: VS = 3 V
    8. 6.8  Typical Characteristics: VS = 5.0 V
    9. 6.9  Typical Characteristics: VS = 3.0 V
    10. 6.10 Typical Characteristics: ±2.5-V to ±1.5-V Split Supply
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 OPA837 Comparison
      2. 7.3.2 Input Common-Mode Voltage Range
      3. 7.3.3 Output Voltage Range
      4. 7.3.4 Power-Down Operation
      5. 7.3.5 Low-Power Applications and the Effects of Resistor Values on Bandwidth
      6. 7.3.6 Driving Capacitive Loads
    4. 7.4 Device Functional Modes
      1. 7.4.1 Split-Supply Operation (±1.35 V to ±2.7 V)
      2. 7.4.2 Single-Supply Operation (2.7 V to 5.4 V)
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Noninverting Amplifier
      2. 8.1.2  Inverting Amplifier
      3. 8.1.3  Output DC Error Calculations
      4. 8.1.4  Output Noise Calculations
      5. 8.1.5  Instrumentation Amplifier
      6. 8.1.6  Attenuators
      7. 8.1.7  Differential to Single-Ended Amplifier
      8. 8.1.8  Differential-to-Differential Amplifier
      9. 8.1.9  Pulse Application With Single-Supply Circuit
      10. 8.1.10 ADC Driver Performance
    2. 8.2 Typical Applications
      1. 8.2.1 Active Filters
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Implementing a 2:1 Active Multiplexer
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 1-Bit PGA Operation
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 相关链接
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Layout Guidelines

The OPA837EVM can be used as a reference when designing the circuit board. TI recommends following the EVM layout of the external components near to the amplifier, ground plane construction, and power routing as closely as possible. General guidelines are listed below:

  1. Signal routing must be direct and as short as possible into and out of the op amp.
  2. The feedback path must be short and direct avoiding vias if possible, especially with G = 1 V/V.
  3. Ground or power planes must be removed from directly under the negative input and output pins of the amplifier.
  4. TI recommends placing a series output resistor as close to the output pin as possible. See Figure 49 for recommended values for the expected capacitive load. These values are derived targeting a 30° phase margin to the output of the op amp.
  5. A 2.2-µF power-supply decoupling capacitor must be placed within two inches of the device and can be shared with other op amps. For split supply, a capacitor is required for both supplies.
  6. A 0.1-µF power-supply decoupling capacitor must be placed as close to the supply pins as possible, preferably within 0.1 inch. For split supply, a capacitor is required for both supplies.
  7. The PD pin uses low logic swing levels. If the pin is not used, PD must be tied to the positive supply to enable the amplifier. If the pin is used, PD must be actively driven. A bypass capacitor is not necessary, but can be used for robustness in noisy environments.