ZHCSQ66A february 2023 – july 2023 OPA2863-Q1
PRODUCTION DATA
THERMAL METRIC(1) | OPA2863-Q1 | UNIT | |
---|---|---|---|
D (SOIC) | |||
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 120.0 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 63.3 | °C/W |
RθJB | Junction-to-board thermal resistance | 63.2 | °C/W |
ΨJT | Junction-to-top characterization parameter | 17.2 | °C/W |
YJB | Junction-to-board characterization parameter | 62.5 | °C/W |