ZHCSMO3J june   2020  – june 2023 OPA2863 , OPA4863 , OPA863

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information: OPA863
    5. 7.5  Thermal Information: OPA2863
    6. 7.6  Thermal Information: OPA4863
    7. 7.7  Electrical Characteristics: VS = 10 V
    8. 7.8  Electrical Characteristics: VS = 3 V
    9. 7.9  Typical Characteristics: VS = 10 V
    10. 7.10 Typical Characteristics: VS = 3 V
    11. 7.11 Typical Characteristics: VS = 3 V to 10 V
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Stage
      2. 8.3.2 Output Stage
        1. 8.3.2.1 Overload Power Limit
      3. 8.3.3 ESD Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Mode
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Low-Side Current Sensing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Front-End Gain and Filtering
      3. 9.2.3 Low-Power SAR ADC Driver and Reference Buffer
      4. 9.2.4 Variable Reference Generator Using MDAC
      5. 9.2.5 Clamp-On Ultrasonic Flow Meter
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Thermal Considerations
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.5 Thermal Information: OPA2863

THERMAL METRIC(1) OPA2863 UNIT
DGK (VSSOP) D (SOIC) RUN (WQFN)
8 PINS 8 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 180.3 120.0 110.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 67.5 63.3 66.8 °C/W
RθJB Junction-to-board thermal resistance 101.9 63.2 43.6 °C/W
ΨJT Junction-to-top characterization parameter 9.8 17.2 2.9 °C/W
YJB Junction-to-board characterization parameter 100.1 62.5 43.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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