ZHCSOS5E May 2022 – June 2024 OPA2863A , OPA863A
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
PIN | TYPE | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
VIN+ | 3 | Input | Noninverting input pin |
VIN– | 4 | Input | Inverting input pin |
VOUT | 1 | Output | Output pin |
VS– | 2 | Power | Negative power-supply pin |
VS+ | 5 | Power | Positive power-supply pin |
PIN | TYPE | DESCRIPTION | ||
---|---|---|---|---|
NAME | NO. | |||
D (SOIC), DGK (VSSOP) |
DSN (USON) | |||
PD1 | — | 5 | Input | Amplifier 1 power down. Low = disabled, high = enabled |
PD2 | — | 6 | Input | Amplifier 2 power down. Low = disabled, high = enabled |
VIN1– | 2 | 2 | Input | Amplifier 1 inverting input pin |
VIN1+ | 3 | 3 | Input | Amplifier 1 noninverting input pin |
VIN2– | 6 | 8 | Input | Amplifier 2 inverting input pin |
VIN2+ | 5 | 7 | Input | Amplifier 2 noninverting input pin |
VOUT1 | 1 | 1 | Output | Amplifier 1 output pin |
VOUT2 | 7 | 9 | Output | Amplifier 2 output pin |
VS– | 4 | 4 | Power | Negative power-supply pin |
VS+ | 8 | 10 | Power | Positive power-supply pin |
Thermal pad | — | Thermal pad | — | Thermal pad. Electrically isolated from the device. Connect to a heat-spreading plane, typically ground. |