ZHCSBR3C December 2013 – May 2018 OPA355-Q1
PRODUCTION DATA.
THERMAL METRIC(1) | OPA355-Q1 | UNIT | |
---|---|---|---|
DBV (SOT-23) | |||
6 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 187.3 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 126.5 | °C/W |
RθJB | Junction-to-board thermal resistance | 32.6 | °C/W |
ψJT | Junction-to-top characterization parameter | 24.1 | °C/W |
ψJB | Junction-to-board characterization parameter | 32.1 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |