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ZHCSI38E March 2001 – April 2018 OPA2355 , OPA3355 , OPA355

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		OPA2355	UNIT
		DGS (VSSOP)
		10 PINS
R_θJA	Junction-to-ambient thermal resistance	171.1	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	58	°C/W
R_θJB	Junction-to-board thermal resistance	92.9	°C/W
ψ_JT	Junction-to-top characterization parameter	6.7	°C/W
ψ_JB	Junction-to-board characterization parameter	91.2	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	—	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.