ZHCSI38E March 2001 – April 2018 OPA2355 , OPA3355 , OPA355
PRODUCTION DATA.
| THERMAL METRIC(1) | OPA3355 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | PW (TSSOP) | |||
| 14 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 85.3 | 113.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 41.4 | 38 | °C/W |
| RθJB | Junction-to-board thermal resistance | 41.5 | 58.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 8.3 | 2.8 | °C/W |
| ψJB | Junction-to-board characterization parameter | 41.2 | 57.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | °C/W |