ZHCSI38E March 2001 – April 2018 OPA2355 , OPA3355 , OPA355
PRODUCTION DATA.
Good high-frequency printed-circuit board (PCB) layout techniques must be used for the OPAx355 amplifiers. Generous use of ground planes, short direct-signal traces, and a preferred bypass capacitor located at the V+ pin ensures clean and stable operation. Large areas of copper help dissipate heat generated within the amplifiers in normal operation.
Sockets are not recommended for use with any high-speed amplifier.
A 10-nF ceramic bypass capacitor is the minimum recommended value; adding a 1-μF or larger tantalum capacitor in parallel is beneficial when driving a low-resistance load. Providing adequate bypass capacitance is essential to achieving very low harmonic and intermodulation distortion.