米6体育平台手机版

ZHCSMQ4F November 2020 – February 2022 OPA2387 , OPA387 , OPA4387

PRODUCTION DATA

6.5 Thermal Information: OPA2387

THERMAL METRIC⁽¹⁾		OPA2387		UNIT
		DGK (VSSOP)	DSG (WSON)
		8 PINS	8 PINS
R_θJA	Junction-to-ambient thermal resistance	165	71.9	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	53	88.8	°C/W
R_θJB	Junction-to-board thermal resistance	87	39.3	°C/W
Ψ_JT	Junction-to-top characterization parameter	4.9	3.2	°C/W
Ψ_JB	Junction-to-board characterization parameter	85	39.2	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	14.3	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.