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ZHCSMQ4F November 2020 – February 2022 OPA2387 , OPA387 , OPA4387

PRODUCTION DATA

Thermal Information: OPA4387

THERMAL METRIC⁽¹⁾		OPA4387	UNIT
		PW (TSSOP)
		14 PINS
R_θJA	Junction-to-ambient thermal resistance	109.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	27.4	°C/W
R_θJB	Junction-to-board thermal resistance	56.1	°C/W
Ψ_JT	Junction-to-top characterization parameter	1.5	°C/W
Ψ_JB	Junction-to-board characterization parameter	54.9	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.