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ZHCSQB4A May 2022 – August 2022 OPA3S2859

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		OPA3S2859	UNIT
		RTW
		24 PINS
R_θJA	Junction-to-ambient thermal resistance	52	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	39.6	°C/W
R_θJB	Junction-to-board thermal resistance	28.2	°C/W
Ψ_JT	Junction-to-top characterization parameter	1.8	°C/W
Ψ_JB	Junction-to-board characterization parameter	28.2	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	13.3	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.