ZHCSLZ5D October   2020  – December 2023 OPA3S328

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Diagram
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Switch Characterization Configurations
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Low Operating Voltage
      2. 7.3.2 Input and ESD Protection
      3. 7.3.3 Programmable Switches
      4. 7.3.4 Rail-to-Rail Input
      5. 7.3.5 Phase Reversal
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Down Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Capacitive Load and Stability
      2. 8.1.2 EMI Susceptibility and Input Filtering
      3. 8.1.3 Transimpedance Amplifier
        1. 8.1.3.1 Optimizing the Transimpedance Circuit
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 TINA-TI™ 仿真软件（免费下载）
        3. 9.1.1.3 TI 参考设计
        4. 9.1.1.4 滤波器设计工具
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10 Revision History

Changes from Revision C (August 2023) to Revision D (December 2023)

  • 将 OPA3S328 YBJ（DSBGA，24）封装状态从预告信息（样片预发布）更改为量产数据（正在供货）Go

Changes from Revision B (November 2021) to Revision C (August 2023)

  • 将 OPA3S328 YBJ（DSBGA，24）封装状态从预发布（无样片）更改为预告信息（样片预发布）Go
  • Changed the ESD rating to the bidirectional valueGo
  • Changed open-loop output impedance symbol from Ro to ZoGo

Changes from Revision A (September 2021) to Revision B (November 2021)

  • Changed YBJ preview Figure 5-2 to correct pin configurationGo
  • Changed YBJ package name from QFN-20 (typo) to DSBGA-24 in note (1) of Table 5-2 and Table 5-3Go

Changes from Revision * (October 2020) to Revision A (September 2021)

  • 将 OPA3S328 RGR (VQFN-20) 封装状态从预告信息（预发布）更改为量产数据（正在供货）Go
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