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ZHCSWX9C January 1995 – August 2024 OPA132 , OPA2132 , OPA4132

PRODUCTION DATA

5.4 Thermal Information - OPA132

THERMAL METRIC⁽¹⁾		OPA132	UNIT
		D (SOIC)
		8 PINS
R_θJA	Junction-to-ambient thermal resistance	160	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	75	°C/W
R_θJB	Junction-to-board thermal resistance	60	°C/W
Ψ_JT	Junction-to-top characterization parameter	9	°C/W
Ψ_JB	Junction-to-board characterization parameter	50	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.