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ZHCSOH5B December 1997 – November 2024 OPA134 , OPA2134 , OPA4134

PRODUCTION DATA

5.4 Thermal Information - OPA134

THERMAL METRIC⁽¹⁾		OPA134		UNIT
		D (SOIC)	P (PDIP)
		8 PINS	8 PINS
R_θJA	Junction-to-ambient thermal resistance	160	73	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	75	50	°C/W
R_θJB	Junction-to-board thermal resistance	60	36	°C/W
Ψ_JT	Junction-to-top characterization parameter	9	17	°C/W
Ψ_JB	Junction-to-board characterization parameter	50	35	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.