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ZHCSOH5B December 1997 – August 2024 OPA134 , OPA2134 , OPA4134

PRODUCTION DATA

5.6 Thermal Information - OPA4134

THERMAL METRIC⁽¹⁾		OPA4132	UNIT
		D (SOIC)
		14 PINS
R_θJA	Junction-to-ambient thermal resistance	97	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	56	°C/W
R_θJB	Junction-to-board thermal resistance	53	°C/W
Ψ_JT	Junction-to-top characterization parameter	19	°C/W
Ψ_JB	Junction-to-board characterization parameter	46	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.