ZHCSFP9B December   2016  – November 2017 OPA170-Q1 , OPA2170-Q1 , OPA4170-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      EMIRR IN+ 与频率间的关系
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1. Table 1. Pin Functions: OPA170-Q1
    2. Table 2. Pin Functions: OPA2170-Q1
    3. Table 3. Pin Functions: OPA4170-Q1
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA170-Q1
    5. 6.5 Thermal Information: OPA2170-Q1
    6. 6.6 Thermal Information: OPA4170-Q1
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics: Table of Graphs
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Characteristics
      2. 7.3.2 Phase-Reversal Protection
      3. 7.3.3 Electrical Overstress
      4. 7.3.4 Capacitive Load and Stability
    4. 7.4 Device Functional Modes
      1. 7.4.1 Common-Mode Voltage Range
      2. 7.4.2 Overload Recovery
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 TINA-TI™（免费软件下载）
        2. 11.1.1.2 DIP 适配器 EVM
        3. 11.1.1.3 通用运算放大器评估模块 (EVM)
        4. 11.1.1.4 TI 高精度设计
        5. 11.1.1.5 WEBENCH滤波器设计器
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 相关链接
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from A Revision (March 2017) to B Revision

  • Deleted 从器件信息 表中删除了 8 引脚 SOIC、5 引脚 SOT、8 引脚 VSSOP 和 14 引脚 SOIC 封装Go
  • Changed 首页图 Go
  • Deleted OPA170-Q1 D (SOIC) and DRL (SOT) pinout drawings and pinout table informationGo
  • Deleted OPA2170-Q1 D (SOIC) and DCU (VSSOP Micro size packagesGo
  • Deleted OPA170-Q1 D (SOIC) pinout drawingGo
  • Deleted D (SOIC) and DRL (SOT) thermal information from OPA170-Q1 Thermal Information table Go
  • Deleted D (SOIC) and DCU (VSSOP) thermal information from OPA2170-Q1 Thermal Information table Go
  • Deleted D (SOIC) thermal information from OPA4170-Q1 Thermal Information table Go
  • Changed values in Figure 38 from 250 Ω to 2.5 kΩ Go

Changes from * Revision (December 2016) to A Revision

  • Deleted 说明中第一段的最后一句Go
  • Deleted static literature number in Thermal Information: OPA170-Q1 table note Go
  • Separated the IB and IOS test conditions for the OPA4170 in Electrical Characteristics tableGo
  • Added additional text to Figure 8 title Go
  • Changed "many specifications apply from –40°C to +125°C" to "many specifications apply from –40°C to +85°C" to correct typoGo
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