米6体育平台手机版

ZHCSPS9C june 2022 – july 2023 OPA186 , OPA2186 , OPA4186

PRODUCTION DATA

6.5 Thermal Information: OPA2186

THERMAL METRIC⁽¹⁾		OPA2186		UNIT
		DDF (SOT-23)	D (SOIC)
		8 PINS	8 PINS
R_θJA	Junction-to-ambient thermal resistance	150.4	128.9	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	85.6	69.2	°C/W
R_θJB	Junction-to-board thermal resistance	70.0	72.3	°C/W
Ψ_JT	Junction-to-top characterization parameter	8.1	20.7	°C/W
Ψ_JB	Junction-to-board characterization parameter	69.6	71.6	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.