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ZHCSPS9C june 2022 – july 2023 OPA186 , OPA2186 , OPA4186

PRODUCTION DATA

6.4 Thermal Information: OPA186

THERMAL METRIC⁽¹⁾		OPA186		UNIT
		D (SOIC)	DBV (SOT-23)
		8 PINS	5 PINS
R_θJA	Junction-to-ambient thermal resistance	135.3	166.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	75.6	62.2	°C/W
R_θJB	Junction-to-board thermal resistance	78.7	38.6	°C/W
Ψ_JT	Junction-to-top characterization parameter	25.4	12.1	°C/W
Ψ_JB	Junction-to-board characterization parameter	78.0	38.2	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.