ZHCSFV2D December 2016 – December 2018 OPA187 , OPA2187 , OPA4187
UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.
| THERMAL METRIC(1) | OPA2187 | UNIT | ||
|---|---|---|---|---|
| 8 PINS | ||||
| DGK (VSSOP) | D (SOIC) | |||
| RθJA | Junction-to-ambient thermal resistance | 159 | 100.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 37 | 42.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 49 | 41.0 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.2 | 4.8 | °C/W |
| ψJB | Junction-to-board characterization parameter | 77.1 | 40.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | °C/W |