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ZHCSGW0E October 2017 – February 2020 OPA202 , OPA2202 , OPA4202

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		OPA2202	UNIT
		DGK (VSSOP)
		8 PINS
R_θJA	Junction-to-ambient thermal resistance	180.1	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	68.3	°C/W
R_θJB	Junction-to-board thermal resistance	101.4	°C/W
Ψ_JT	Junction-to-top characterization parameter	10.5	°C/W
Ψ_JB	Junction-to-board characterization parameter	99.8	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.