ZHCSI30G March 2002 – April 2018 OPA2354 , OPA354 , OPA4354
PRODUCTION DATA.
| THERMAL METRIC(1) | OPA354 | UNIT | ||
|---|---|---|---|---|
| DBV (SOT-23) | DDA (HSOP) | |||
| 5 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 216.3 | 42.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 84.3 | 54 | °C/W |
| RθJB | Junction-to-board thermal resistance | 43.1 | 26.5 | °C/W |
| ψJT | Junction-to-top characterization parameter | 3.8 | 8 | °C/W |
| ψJB | Junction-to-board characterization parameter | 42.3 | 26.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | 3.6 | °C/W |