ZHCSI30G March 2002 – April 2018 OPA2354 , OPA354 , OPA4354
PRODUCTION DATA.
| THERMAL METRIC(1) | OPA4354 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | PW (TSSOP) | |||
| 14 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 83.8 | 92.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 70.7 | 27.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 59.5 | 33.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 11.6 | 1.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 37.7 | 33.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | °C/W |