ZHCSI30G March 2002 – April 2018 OPA2354 , OPA354 , OPA4354
PRODUCTION DATA.
Good high-frequency printed-circuit board (PCB) layout techniques must be employed for the OPAx354. Generous use of ground planes, short and direct signal traces, and a suitable bypass capacitor located at the V+ pin ensure clean, stable operation. Large areas of copper provides a means of dissipating heat that is generated in normal operation.
TI does not recommend using sockets with any high-speed amplifier.
A 10-nF ceramic bypass capacitor is the minimum recommended value; adding a 1-µF or larger tantalum capacitor in parallel is beneficial when driving a low-resistance load. Providing adequate bypass capacitance is essential to achieving low harmonic and intermodulation distortion.