SBOS391B December   2007  – March 2016 OPA454

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: VS = ±50 V
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Input Protection
      2. 9.3.2 Input Range
      3. 9.3.3 Output Range
      4. 9.3.4 Open-Loop Gain Linearity
      5. 9.3.5 Settling Time
      6. 9.3.6 ENABLE and E/D Com
      7. 9.3.7 Current Limit
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Applications Information
      1. 10.1.1 Lowering Offset Voltage and Drift
      2. 10.1.2 Increasing Output Current
      3. 10.1.3 Unity-Gain Noninverting Configuration
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
    3. 10.3 System Examples
      1. 10.3.1 Basic Noninverting Amplifier
      2. 10.3.2 Programmable Voltage Source
      3. 10.3.3 Bridge Circuit
      4. 10.3.4 High-Compliance Voltage Current Sources
      5. 10.3.5 High-Voltage Instrumentation Amplifier
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Thermally-Enhanced PowerPAD Package
      2. 12.1.2 PowerPAD Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Protection
    4. 12.4 Power Dissipation
    5. 12.5 Heatsinking
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
        1. 13.1.1.1 TINA-TI™ (Free Software Download)
        2. 13.1.1.2 TI Precision Designs
        3. 13.1.1.3 WEBENCH Filter Designer
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Pin Configuration and Functions

DDA PACKAGE
8-Pin SO PowerPAD
Top View
OPA454 po_so_bos391.gif
1. PowerPAD is internally connected to V–. Soldering the PowerPAD to the printed-circuit board (PCB) is always required, even with applications that have low power dissipation.

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
E/D (Enable/Disable) 8 I Enable/Disable
E/D Com 1 I Enable/Disable common
–IN 2 I Inverting input
+IN 3 I Noninverting input
OUT 6 O Output
Status Flag 5 O The Status Flag is an open-drain active-low output referenced to E/D Com. This pin goes active for either an overcurrent or overtemperature condition.
V– 4 — Negative (lowest) power supply
V+ 7 — Positive (highest) power supply
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