ZHCS228A June   2011  – February 2024 OPA564-Q1

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Adjustable Current Limit
        1. 7.3.1.1 Setting the Current Limit
      2. 7.3.2 Enable and Shutdown (E/S) Pin
      3. 7.3.3 Input Protection
      4. 7.3.4 Output Shutdown
      5. 7.3.5 Microcontroller Compatibility
      6. 7.3.6 Current Limit Flag
      7. 7.3.7 Thermal Protection
      8. 7.3.8 Junction Temperature Measurement Using TSENSE
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Configuration
      2. 8.1.2 Output-Stage Compensation
      3. 8.1.3 Output Protection
      4. 8.1.4 Power Dissipation and Safe Operating Area
    2. 8.2 Typical Applications
      1. 8.2.1 Improved Howland Current Pump
      2. 8.2.2 Programmable Power Supply
      3. 8.2.3 Powerline Communication
      4. 8.2.4 Motor-Drive Circuit
      5. 8.2.5 DC Motor-Speed Controller (Without Tachometer)
      6. 8.2.6 Generating VDIG
      7. 8.2.7 Temperature Measurement
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Thermally Enhanced PowerPAD™ Integrated Circuit Package
          1. 8.4.1.1.1 Bottom-Side Thermal Pad Assembly Process
  10. Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from Revision * (June 2011) to Revision A (February 2024)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 添加了封装信息 表以及引脚配置和功能规格ESD 等级建议运行条件热性能信息详细说明概述功能方框图、 特性说明器件功能模式、 应用和实现典型应用电源相关建议布局器件和文档支持机械、封装和可订购信息 部分Go
  • 删除了预发布 DWD 封装和相关内容Go
  • 将 HSOP 的实例更改为 HSOIC(拼写错误)Go
  • 将首页图中的 20kΩ 电阻器标签从 R4 更改为 R3 (拼写错误)Go
  • Updated Related Products table and renamed to Device Comparison Table Go
  • Changed Operating Junction Temperature to Operating Ambient Temperature and moved to new Recommended Operating Conditions Go
  • Updated format of Electrical Characteristics Go
  • Changed Output current limit range typical value from "±0.4 to ±2.0" to "±0.4 to ±1.9"Go
  • Changed current limit flag output typical value for normal operation from 0 to V–Go
  • Changed Thermal Shutdown typical value for normal operation from 0 to V–Go
  • Changed current limit value range from "0.4A to 1.5A" to "0.4A to 1.6A" in Adjustable Current Limit Go
  • Added text regarding adjustable current limit used to protect the device in Adjustable Current Limit Go
  • Updated equation terms for consistencyGo
  • Changed RCL to RSET in Figure 7-1, Adjustable Current Limit Go
  • Added text regarding IFLAG pin to last sentence of Current Limit Flag Go
  • Added text regarding TFLAG pin to first paragraph of Thermal Protection Go
  • Added R1 and R2 resistor labels to Figure 8-1, Basic Noninverting Amplifier Go
  • Changed copper plane size from 9in2 to 3in2 to match Figure 8-2 in Power Dissipation and Safe Operating Area Go
  • Changed Figure 8-4, Thermal Resistance vs Circuit Board Copper Area, to align with Thermal Information Go
  • Changed Figure 8-6, Improved Howland Current Pump, 20kΩ resistor from R4 to R3 (typo), and deleted footnoteGo
  • Added text to clarify application operation in Programmable Power Supply Go
  • Moved misplaced junction dot to correct location in Figure 8-10, Motor-Drive Circuit Go