ZHCSTX5B September   2000  – April 2024 OPA627 , OPA637

PRODMIX  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information: OPA627
    5. 5.5 Thermal Information: OPA637
    6. 5.6 Electrical Characteristics: OPA627BU, OPA627AU
    7. 5.7 Electrical Characteristics: OPA627AM, OPA627BM, OPA627SM
    8. 5.8 Electrical Characteristics: OPA637
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Offset Voltage Adjustment
      2. 6.3.2 Noise Performance
      3. 6.3.3 Input Bias Current
      4. 6.3.4 Phase-Reversal Protection
      5. 6.3.5 Output Overload
      6. 6.3.6 Capacitive Loads
      7. 6.3.7 Input Protection
      8. 6.3.8 EMI Rejection Ratio (EMIRR)
        1. 6.3.8.1 EMIRR IN+ Test Configuration
      9. 6.3.9 Settling Time
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 TINA-TI™ 仿真软件（免费下载）
        2. 8.1.1.2 Analog Filter Designer
        3. 8.1.1.3 TI 参考设计
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 接收文档更新通知
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.5 Thermal Information: OPA637

THERMAL METRIC(1) OPA637 UNIT
D (SOIC) LMC (TO-99)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 107.9 200 ℃/W
RθJC(top) Junction-to-case (top) thermal resistance 57.3 N/A ℃/W
RθJB Junction-to-board thermal resistance 49.7 N/A ℃/W
ψJT Junction-to-top characterization parameter 11.7 N/A ℃/W
ψJB Junction-to-board characterization parameter 48.9 N/A ℃/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A ℃/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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