ZHCSR21I December   2003  – October 2024 OPA695

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics VS = ±5 V, OPA695ID, OPA695IDBV
    6. 5.6  Electrical Characteristics VS = 5 V, OPA695ID, OPA695IDBV
    7. 5.7  Electrical Characteristics VS = ±5 V, OPA695IDGK
    8. 5.8  Electrical Characteristics VS = 5 V, OPA695IDGK
    9. 5.9  Typical Characteristics: VS = ±5 V, OPA695IDBV, OPA695ID
    10. 5.10 Typical Characteristics: VS = 5 V, OPA695IDBV, OPA695ID
    11. 5.11 Typical Characteristics: VS = ±5 V, OPA695IDGK
    12. 5.12 Typical Characteristics: VS = 5 V, OPA695IDGK
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Wideband Current-Feedback Operation
      2. 6.3.2 Input and ESD Protection
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Operating Suggestions
        1. 7.1.1.1 Setting Resistor Values to Optimize Bandwidth
        2. 7.1.1.2 Output Current and Voltage
        3. 7.1.1.3 Driving Capacitive Loads
        4. 7.1.1.4 Distortion Performance
        5. 7.1.1.5 Noise Performance
        6. 7.1.1.6 Thermal Analysis
      2. 7.1.2 LO Buffer Amplifier
      3. 7.1.3 Wideband Cable Driving Applications
        1. 7.1.3.1 Cable Modem Return Path Driver
        2. 7.1.3.2 Arbitrary Waveform Driver
      4. 7.1.4 Differential I/O Applications
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
        1. 7.2.1.1 Saw Filter Buffer
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Design-In Tools
        1. 8.1.1.1 Demonstration Fixtures
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 接收文档更新通知
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1) OPA695 UNIT
D (SOIC) DBV (SOT 23) DGK (VSSOP)
8 PINS 6 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 136 164 135 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 78 80 81 °C/W
RθJB Junction-to-board thermal resistance 85 49 56 °C/W
ΨJT Junction-to-top characterization parameter 24 28 8.5 °C/W
YJB Junction-to-board characterization parameter 84 49 48 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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