米6体育平台手机版

ZHCSOI9B July 2022 – December 2024 OPA817

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		OPA817	UNIT
		DTK (WSON)
		8 PINS
R_θJA	Junction-to-ambient thermal resistance	64.9	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	53.0	°C/W
R_θJB	Junction-to-board thermal resistance	32.8	°C/W
Ψ_JT	Junction-to-top characterization parameter	1.3	°C/W
Ψ_JB	Junction-to-board characterization parameter	32.8	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	9.0	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.