ZHCSOI9A July 2022 – December 2022 OPA817
PRODUCTION DATA
| THERMAL METRIC(1) | OPA817 | UNIT | |
|---|---|---|---|
| DTK (WSON) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 64.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 53.0 | °C/W |
| RθJB | Junction-to-board thermal resistance | 32.8 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 1.3 | °C/W |
| YJB | Junction-to-board characterization parameter | 32.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 9.0 | °C/W |