米6体育平台手机版

ZHCS020J January 2011 – March 2021 OPA2835 , OPA835

PRODUCTION DATA

7.5 Thermal Information: OPA2835

THERMAL METRIC⁽¹⁾		OPA2835				UNIT
		D (SOIC)	DGS (VSSOP)	RUN (QFN)	RMC (UQFN)
		8 PINS	10 PINS	10 PINS	10 PINS
R_θJA	Junction-to-ambient thermal resistance	150.1	206	145.8	143.2	°C/W
R_θJCtop	Junction-to-case (top) thermal resistance	83.8	75.3	75.1	49.0	°C/W
R_θJB	Junction-to-board thermal resistance	68.4	96.2	38.9	61.9	°C/W
ψ_JT	Junction-to-top characterization parameter	33.0	12.9	13.5	3.3	°C/W
ψ_JB	Junction-to-board characterization parameter	67.9	94.6	104.5	61.9	°C/W

(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).