ZHCS019J January   2011  – March 2021 OPA2836 , OPA836

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: OPA836
    5. 7.5 Thermal Information: OPA2836
    6. 7.6 Electrical Characteristics: VS = 2.7 V
    7. 7.7 Electrical Characteristics: VS = 5 V
    8. 7.8 Typical Characteristics: VS = 2.7 V
    9. 7.9 Typical Characteristics: VS = 5 V
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Input Common-Mode Voltage Range
      2. 8.3.2 Output Voltage Range
      3. 8.3.3 Power-Down Operation
      4. 8.3.4 Low-Power Applications and the Effects of Resistor Values on Bandwidth
      5. 8.3.5 Driving Capacitive Loads
    4. 8.4 Device Functional Modes
      1. 8.4.1 Split-Supply Operation (±1.25 V to ±2.75 V)
      2. 8.4.2 Single-Supply Operation (2.5 V to 5.5 V)
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1  Noninverting Amplifier
      2. 9.1.2  Inverting Amplifier
      3. 9.1.3  Instrumentation Amplifier
      4. 9.1.4  Attenuators
      5. 9.1.5  Single-Ended-to-Differential Amplifier
      6. 9.1.6  Differential-to-Signal-Ended Amplifier
      7. 9.1.7  Differential-to-Differential Amplifier
      8. 9.1.8  Gain Setting With OPA836 RUN Integrated Resistors
      9. 9.1.9  Pulse Application With Single-Supply
      10. 9.1.10 ADC Driver Performance
    2. 9.2 Typical Applications
      1. 9.2.1 Audio Frequency Performance
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Active Filters
        1. 9.2.2.1 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
      2. 12.1.2 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 静电放电警告
    5. 12.5 术语表
    6. 12.6 Trademarks
  13. 13Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

7.5 Thermal Information: OPA2836

THERMAL METRIC(1)OPA2836UNIT
D (SOIC-8)(DGS) VSSOP, MSOP-10(RUN) WQFN-10RMC (UQFN-10)
8 PINS10 PINS10 PINS10 PINS
RθJAJunction-to-ambient thermal resistance150.1206145.8143.2°C/W
RθJCtopJunction-to-case (top) thermal resistance83.875.375.149.0°C/W
RθJBJunction-to-board thermal resistance68.496.238.961.9°C/W
ψJTJunction-to-top characterization parameter33.012.913.53.3°C/W
ψJBJunction-to-board characterization parameter67.994.6104.561.9°C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).
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