ZHCSGM4D August   2017  – September 2024 OPA838

PRODMIX  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics VS = 5 V
    6. 6.6 Electrical Characteristics VS = 3 V
    7. 6.7 Typical Characteristics: VS = 5 V
    8. 6.8 Typical Characteristics: VS = 3 V
    9. 6.9 Typical Characteristics: Over Supply Range
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Common-Mode Voltage Range
      2. 7.3.2 Output Voltage Range
      3. 7.3.3 Power-Down Operation
      4. 7.3.4 Trade-Offs in Selecting The Feedback Resistor Value
      5. 7.3.5 Driving Capacitive Loads
    4. 7.4 Device Functional Modes
      1. 7.4.1 Split-Supply Operation (±1.35 V to ±2.7 V)
      2. 7.4.2 Single-Supply Operation (2.7 V to 5.4 V)
      3. 7.4.3 Power Shutdown Operation
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Noninverting Amplifier
      2. 8.1.2 Inverting Amplifier
      3. 8.1.3 Output DC Error Calculations
      4. 8.1.4 Output Noise Calculations
    2. 8.2 Typical Applications
      1. 8.2.1 High-Gain Differential I/O Designs
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Transimpedance Amplifier
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 开发支持
        1. 9.1.1.1 TINA-TI™ 仿真软件(免费下载)
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from Revision C (October 2023) to Revision D (September 2024)

  • 向数据表添加了 DXB(X2QFN,8)封装和相关内容Go

Changes from Revision B (October 2018) to Revision C (October 2023)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 器件信息 表更改为封装信息,更新了列并添加了注释 2Go

Changes from Revision A (February 2018) to Revision B (October 2018)

  • 特性 部分中的 < 5μA 关断电流 更改为 < 1μA 关断电流 Go
  • Changed value of common-mode and differential-mode input impedance in Electrical Characteristics VS = 5 V and Electrical Characteristics VS = 3 V tablesGo
  • Changed value of power-down quiescent current in Electrical Characteristics: VS = 5 V and Electrical Characteristics VS = 3 V tablesGo
  • Changed 5 µA to 1 µA in Overview section Go
  • Changed standby current from 5 µA to 1 µA in Power-Down Operation sectionGo
  • Changed common-mode input capacitance from 1.3 pF to 1 pF in Trade-Offs in Selecting The Feedback Resistor Value sectionGo
  • Changed 1 + 6.3 / 1.2 = 6.25 V/V, adding the 1.3-pF device common-mode capacitance to 1 + 6 / 1.2 = 6 V/V, adding the 1-pF device common-mode capacitance in Trade-Offs in Selecting The Feedback Resistor Value sectionGo
  • Changed 2 µA to 0.1 µA and 5 µA to 1 µA in last sentence of Power Shutdown Operation sectionGo
  • Changed Power Supply Recommendations and Thermal Notes title to Power Supply Recommendations Go