ZHCSMN3B
February 2021 – January 2023
OPA855-Q1
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Thermal Information
7.4
Recommended Operating Conditions
7.5
Electrical Characteristics
7.6
Typical Characteristics
8
Parameter Measurement Information
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
Input and ESD Protection
9.3.2
Feedback Pin
9.3.3
Wide Gain-Bandwidth Product
9.3.4
Slew Rate and Output Stage
9.4
Device Functional Modes
9.4.1
Split-Supply and Single-Supply Operation
9.4.2
Power-Down Mode
10
Application, Implementation, and Layout
10.1
Application Information
10.2
Typical Application
10.2.1
Design Requirements
10.2.2
Detailed Design Procedure
10.2.3
Application Curves
10.3
Typical Application
10.3.1
Design Requirements
10.3.2
Detailed Design Procedure
10.3.3
Application Curves
11
Power Supply Recommendations
12
Layout
12.1
Layout Guidelines
12.2
Layout Example
13
Device and Documentation Support
13.1
Device Support
13.1.1
Development Support
13.2
Documentation Support
13.2.1
Related Documentation
13.3
Receiving Notification of Documentation Updates
13.4
支持资源
13.5
Trademarks
13.6
静电放电警告
13.7
术语表
14
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
DSG|8
MPDS308C
散热焊盘机械数据 (封装 | 引脚)
DSG|8
QFND141I
订购信息
zhcsmn3b_oa
zhcsmn3b_pm
13.7
术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
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