ZHCSK39C August   2019  – August 2020 OPA862

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: VS = ±2.5 V to ±5 V
    6. 6.6 Typical Characteristics: VS = ±5 V
    7. 6.7 Typical Characteristics: VS = ±2.5 V
    8. 6.8 Typical Characteristics: VS = 1.9 V, –1.4 V
    9. 6.9 Typical Characteristics: VS = 1.9 V, –1.4 V to ±5 V
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input and ESD Protection
      2. 7.3.2 Anti-Phase Reversal Protection
      3. 7.3.3 Precision and Low Noise
    4. 7.4 Device Functional Modes
      1. 7.4.1 Split-Supply Operation (±1.5 V to ±6.3 V)
      2. 7.4.2 Single-Supply Operation (3 V to 12.6 V)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Single-Ended-to-Differential Gain of 4 V/V
    2. 8.2 Typical Applications
      1. 8.2.1 Single-Ended to Differential with 2.5-V Output Common-Mode Voltage
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Transimpedance Amplifier Configuration
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 DC Level-Shifting
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) OPA862 UNIT
D (SOIC) DTK (WSON)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 125.7 65.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 65.9 56.7 °C/W
RθJB Junction-to-board thermal resistance 69.1 34.4 °C/W
ΨJT Junction-to-top characterization parameter 18 1.6 °C/W
ΨJB Junction-to-board characterization parameter 68.3 34.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 8.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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