ZHCSMO3J june   2020  – june 2023 OPA2863 , OPA4863 , OPA863

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information: OPA863
    5. 7.5  Thermal Information: OPA2863
    6. 7.6  Thermal Information: OPA4863
    7. 7.7  Electrical Characteristics: VS = 10 V
    8. 7.8  Electrical Characteristics: VS = 3 V
    9. 7.9  Typical Characteristics: VS = 10 V
    10. 7.10 Typical Characteristics: VS = 3 V
    11. 7.11 Typical Characteristics: VS = 3 V to 10 V
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Stage
      2. 8.3.2 Output Stage
        1. 8.3.2.1 Overload Power Limit
      3. 8.3.3 ESD Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Mode
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Low-Side Current Sensing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Front-End Gain and Filtering
      3. 9.2.3 Low-Power SAR ADC Driver and Reference Buffer
      4. 9.2.4 Variable Reference Generator Using MDAC
      5. 9.2.5 Clamp-On Ultrasonic Flow Meter
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Thermal Considerations
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision I (December 2022) to Revision J (June 2023)

  • 将 OPA4863 PW（TSSOP，14）封装的状态从预发布 更改为量产 并添加了相关内容Go

Changes from Revision H (August 2022) to Revision I (December 2022)

  • 将 DBV（SOT23，5）封装的状态从预发布 更改为量产 Go

Changes from Revision G (July 2022) to Revision H (August 2022)

  • Changed the status of the RUN Package, from: preview to: production Go

Changes from Revision F (April 2022) to Revision G (July 2022)

  • 向特性 部分添加了 OPAx863A 信息Go
  • 向数据表添加了 DBV（SOT23，5）封装Go
  • Changed the status of the D Package, from: preview to: production Go
  • Updated the Output Voltage vs Load Current and Output Voltage vs Load Current figures to show typical device performanceGo

Changes from Revision E (November 2021) to Revision F (April 2022)

  • 向数据表添加了 D（SOIC，8）封装和 RUN（WQFN，10）封装Go
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