ZHCSOS5E May   2022  – June 2024 OPA2863A , OPA863A

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information OPA863A
    5. 6.5  Thermal Information OPA2863A
    6. 6.6  Electrical Characteristics VS = ±5 V
    7. 6.7  Electrical Characteristics VS = 3 V
    8. 6.8  Typical Characteristics: VS = ±5 V
    9. 6.9  Typical Characteristics: VS = 3 V
    10. 6.10 Typical Characteristics: VS = 3 V to 10 V
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Stage
      2. 7.3.2 Output Stage
        1. 7.3.2.1 Overload Power Limit
      3. 7.3.3 ESD Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Down Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Active Filters
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Low-Power SAR ADC Driver and Reference Buffer
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBV|5
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.3.2 Output Stage

The OPAx863A feature a rail-to-rail output stage with possible signal swing from VS– + 0.2 V to VS+ – 0.2 V. Violating the output headroom of either supply causes output signal clipping and introduces distortion.

The OPAx863A integrate an output short-circuit protection circuit that makes the device rugged for use in real-world applications.
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