ZHCSNI6A March   2023  – April 2024 OPA928

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics: 4.5V ≤ VS < 8V
    6. 5.6 Electrical Characteristics: 8V ≤ VS ≤ 16V
    7. 5.7 Electrical Characteristics: 16V < VS ≤ 36V
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Guard Buffer
      2. 6.3.2 Input Protection
      3. 6.3.3 Thermal Protection
      4. 6.3.4 Capacitive Load and Stability
      5. 6.3.5 EMI Rejection
      6. 6.3.6 Common-Mode Voltage Range
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Contamination Considerations
      2. 7.1.2 Guarding Considerations
      3. 7.1.3 Single-Supply Considerations
      4. 7.1.4 Humidity Considerations
      5. 7.1.5 Dielectric Relaxation
      6. 7.1.6 Shielding
    2. 7.2 Typical Applications
      1. 7.2.1 High-Impedance Amplifier
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Transimpedance Amplifier
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
          1. 7.2.2.2.1 Input Bias
          2. 7.2.2.2.2 Offset Voltage
          3. 7.2.2.2.3 Stability
          4. 7.2.2.2.4 Noise
      3. 7.2.3 Improved Diode Limiter
      4. 7.2.4 Instrumentation Amplifier
    3. 7.3 Power-Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Examples
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 PSpice® for TI
        2. 8.1.1.2 TINA-TI™ 仿真软件(免费下载)
        3. 8.1.1.3 TI 参考设计
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 接收文档更新通知
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息
Stability

High transimpedance gain applications require very large RF to be used, which can give rise to potential stability problems. RF interacts with the input capacitance (CIN) of the op amp, the photodiode capacitance (CPD), and stray PCB capacitance to create a low-frequency zero (fZ) in the noise gain transfer function (1/β) as illustrated in Figure 7-13. Remember that CIN includes the differential (CDF) and common-mode (CCM) capacitance of the op amp. The typical value of CDF and CCM are found in the Electrical Characteristics. The zero in 1/β causes the gain to increase over frequency and is the basis for instability problems. To counteract the zero, add a compensation capacitor (CF) in the feedback loop to create a pole (fP). Increasingly, larger RF requires a decreasingly lower capacitor to remain stable. In some cases, parasitic capacitance from the resistor and PCB layout can alone be sufficient to maintain stability.

OPA928 Transimpedance Amplifier Noise
                    Gain Figure 7-13 Transimpedance Amplifier Noise Gain

The optimized selection of CF depends on several parameters and extensive literature exists on this topic. Equation 2 provides a good starting point for the selection of CF.

Equation 2. C F = 1 ± 1 + 8 π G B W R F ( C I N + C P D ) 4 π G B W R F

Increasing the value of CF yields a higher phase margin and limits the peaking response at the expense of signal bandwidth. The bandwidth of the transimpedance amplifier is given by Equation 3. Large RF significantly limit the achievable bandwidth of the circuit. A compromise between gain, bandwidth, and stability can be made according to the specific requirements.

Equation 3. f - 3 d B = 1 2 π R F C F