ZHCSGP7 August   2017 OPT3007

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Human Eye Matching
      2. 7.3.2 Automatic Full-Scale Range Setting
      3. 7.3.3 I2C Bus Overview
        1. 7.3.3.1 Serial Bus Address
        2. 7.3.3.2 Serial Interface
    4. 7.4 Device Functional Modes
      1. 7.4.1 Automatic Full-Scale Setting Mode
    5. 7.5 Programming
      1. 7.5.1 Writing and Reading
        1. 7.5.1.1 High-Speed I2C Mode
        2. 7.5.1.2 General-Call Reset Command
    6. 7.6 Register Maps
      1. 7.6.1 Internal Registers
        1. 7.6.1.1 Register Descriptions
          1. 7.6.1.1.1 Result Register (Offset = 00h)
          2. 7.6.1.1.2 Configuration Register (Offset = 01h) [Reset = C810h]
          3. 7.6.1.1.3 Low-Limit Register (Offset = 02h) [Reset = C0000h]
          4. 7.6.1.1.4 High-Limit Register (Offset = 03h) [Reset = BFFFh]
          5. 7.6.1.1.5 Manufacturer ID Register (Offset = 7Eh) [Reset = 5449h]
          6. 7.6.1.1.6 Device ID Register (Offset = 7Fh) [Reset = 3001h]
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Electrical Interface
      2. 8.1.2 Optical Interface
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Optomechanical Design
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
  9. 9 Power-Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Soldering and Handling Recommendations
      1. 10.2.1 Solder Paste
      2. 10.2.2 Package Placement
      3. 10.2.3 Reflow Profile
      4. 10.2.4 Special Flexible Printed-Circuit Board (FPCB) Recommendations
      5. 10.2.5 Rework Process
    3. 10.3 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings(1)

MIN MAX UNIT
Voltage VDD to GND –0.5 6 V
SDA and SCL to GND –0.5 6 V
Current into any pin 10 mA
Temperature Junction 150 °C
Storage, Tstg –65 150(2) °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Long exposure to temperatures higher than 105°C can cause package discoloration, spectral distortion, and measurement inaccuracy.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
Operating temperature –40 85 °C
Operating power-supply voltage 1.6 3.6 V

6.4 Thermal Information

THERMAL METRIC(1) OPT3007 UNIT
YMF (PicoStar)
6 PINS
RθJA Junction-to-ambient thermal resistance 122.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 1.4 °C/W
RθJB Junction-to-board thermal resistance 34.9 °C/W
ψJT Junction-to-top characterization parameter 0.8 °C/W
ψJB Junction-to-board characterization parameter 35.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

At TA = 25°C, VDD = 3.3 V, 800-ms conversion time (CT = 1)(2), automatic full-scale range (RN[3:0] = 1100b(2)), white LED, and normal-angle incidence of light, unless otherwise specified.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OPTICAL
Peak irradiance spectral responsivity 550 nm
Resolution (LSB) Lowest full-scale range, RN[3:0] = 0000b(2) 0.01 lux
Full-scale illuminance 83865.6 lux
Measurement output result 0.64 lux per ADC code, 2620.80 lux full-scale (RN[3:0] = 0110)(2), 2000 lux input(3) 2500 3125 3750 ADC codes
1600 2000 2400 lux
Relative accuracy between gain ranges(1) 0.2%
Infrared response (850 nm)(3) 0.2%
Light source variation
(incandescent, halogen, fluorescent)		 Bare device, no cover glass 4%
Linearity Input illuminance > 40 lux 2%
Input illuminance < 40 lux 5%
Measurement drift across temperature Input illuminance = 2000 lux 0.01 %/°C
Dark condition, ADC output 0.01 lux per ADC code 0 3 ADC codes
0 0.03 lux
Half-power angle 50% of full-power reading 44 degrees
PSRR Power-supply rejection ratio VDD at 3.6 V and 1.6 V 0.1 %/V(4)
POWER SUPPLY
VDD Operating range 1.6 3.6 V
VI²C Operating range of I2C pull-up resistor I2C pullup resistor, VDD ≤ VI²C 1.6 5.5 V
IQ Quiescent current Dark Active, VDD = 3.6 V 1.8 2.5 µA
Shutdown (M[1:0] = 00)(2), VDD = 3.6 V 0.3 0.47 µA
Full-scale lux Active, VDD = 3.6 V 3.7 µA
Shutdown,
(M[1:0] = 00)(2)		 0.4 µA
POR Power-on-reset threshold TA = 25°C 0.8 V
DIGITAL
I/O pin capacitance 3 pF
Total integration time(5) (CT = 1)(2), 800-ms mode, fixed lux range 720 800 880 ms
(CT = 0)(2), 100-ms mode, fixed lux range 90 100 110 ms
VIL Low-level input voltage
(SDA and SCL)		 0 0.3 × VDD V
VIH High-level input voltage
(SDA and SCL)		 0.7 × VDD 5.5 V
IIL Low-level input current
(SDA and SCL)		 0.01 0.25(6) µA
VOL Low-level output voltage
(SDA)		 IOL= 3 mA 0.32 V
IZH Output logic high, high-Z leakage current (SDA) Pin at VDD 0.01 0.25(6) µA
TEMPERATURE
Specified temperature range –40 85 °C
(1) Characterized by measuring fixed near-full-scale light levels on the higher adjacent full-scale range setting.
(2) Refers to a control field within the configuration register.
(3) Tested with the white LED calibrated to 2k lux and an 850-nm LED.
(4) PSRR is the percent change of the measured lux output from its current value, divided by the change in power supply voltage, as characterized by results from 3.6-V and 1.6-V power supplies.
(5) The conversion time, from start of conversion until the data are ready to be read, is the integration time plus 3 ms.
(6) The specified leakage current is dominated by the production test equipment limitations. Typical values are much smaller.

6.6 Timing Requirements(1)

MIN TYP MAX UNIT
I2C FAST MODE
fSCL SCL operating frequency 0.01 0.4 MHz
tBUF Bus free time between stop and start 1300 ns
tHDSTA Hold time after repeated start 600 ns
tSUSTA Setup time for repeated start 600 ns
tSUSTO Setup time for stop 600 ns
tHDDAT Data hold time 20 900 ns
tSUDAT Data setup time 100 ns
tLOW SCL clock low period 1300 ns
tHIGH SCL clock high period 600 ns
tRC and tFC Clock rise and fall time 300 ns
tRD and tFD Data rise and fall time 300 ns
tTIMEO Bus timeout period. If the SCL line is held low for this duration of time, the bus state machine is reset. 28 ms
I2C HIGH-SPEED MODE
fSCL SCL operating frequency 0.01 2.6 MHz
tBUF Bus free time between stop and start 160 ns
tHDSTA Hold time after repeated start 160 ns
tSUSTA Setup time for repeated start 160 ns
tSUSTO Setup time for stop 160 ns
tHDDAT Data hold time 20 140 ns
tSUDAT Data setup time 20 ns
tLOW SCL clock low period 240 ns
tHIGH SCL clock high period 60 ns
tRC and tFC Clock rise and fall time 40 ns
tRD and tFD Data rise and fall time 80 ns
tTIMEO Bus timeout period. If the SCL line is held low for this duration of time, the bus state machine is reset. 28 ms
(1) All timing parameters are referenced to low and high voltage thresholds of 30% and 70%, respectively, of final settled value.
OPT3007 aij_I2C_Timing_R2.gif Figure 1. I2C Detailed Timing Diagram

6.7 Typical Characteristics

At TA = 25°C, VDD = 3.3 V, 800-ms conversion time (CT = 1), automatic full-scale range (RN[3:0] = 1100b), white LED, and normal-angle incidence of light, unless otherwise specified.
OPT3007 D001_SBOS864.gif
Figure 2. Spectral Response vs Wavelength
OPT3007 D003_SBOS698.gif
Figure 4. Output Response vs Input Illuminance
(Higher Range = 0 Lux to 16k Lux)
OPT3007 D005_SBOS698.gif
Figure 6. Output Response vs Input Illuminance
(Low Range = 0 Lux to 5 Lux)
OPT3007 D007_SBOS698.gif
Input illuminance = 960 lux,
normalized to response of 2560 lux full-scale
Figure 8. Full-Scale-Range Matching (Highest 6 Ranges)
OPT3007 D008_SBOS681.gif
Figure 10. Normalized Response vs Temperature
OPT3007 D009_SBOS681.gif
Figure 12. Normalized Response vs Power-Supply Voltage
OPT3007 D011_SBOS681.gif
M[1:0] = 10b
Figure 14. Supply Current vs Input Illuminance
OPT3007 D013_SBOS681.gif
M[1:0] = 10b
Figure 16. Supply Current vs Temperature
OPT3007 D015_SBOS681.gif
Input illuminance = 80 lux, SCL = SDA,
continuously toggled at I2C frequency
Note: A typical application runs at a lower duty cycle and thus consumes a lower current.
Figure 18. Supply Current vs Continuous I2C Frequency
OPT3007 D002_SBOS698.gif
Figure 3. Output Response vs Input Illuminance, Multiple Light Sources (Fluorescent, Halogen, Incandescent)
OPT3007 D004_SBOS698.gif
Figure 5. Output Response vs Input Illuminance
(Mid Range = 0 Lux to 100 Lux)
OPT3007 D006_SBOS698.gif
Input illuminance = 30 lux,
normalized to response of 40.95 lux full-scale
Figure 7. Full-Scale-Range Matching (Lowest 7 Ranges)
OPT3007 D016_SBOS698.gif
Average of 30 devices
Figure 9. Dark Response vs Temperature
OPT3007 D017_SBOS698.gif
Figure 11. Conversion Time vs Power Supply
OPT3007 D010_SBOS698.gif
Figure 13. Normalized Response vs Illuminance Angle
OPT3007 D012_SBOS681.gif
M[1:0] = 00b
Figure 15. Shutdown Current vs Input Illuminance
OPT3007 D014_SBOS681.gif
M[1:0] = 00b, input illuminance = 0 lux
Figure 17. Shutdown Current vs Temperature
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