Use a pick-and-place nozzle with a size number larger than 0.6 mm. If the placement method is done by programming the component thickness, then add 0.04 mm to the actual component thickness so that the package sits halfway into the solder paste. If placement is by force, then choose minimum force no larger than 3N to avoid forcing out solder paste, or free falling the package, and to avoid soldering problems such as bridging and solder balling.