If the device must be removed from a PCB, discard the device and do not reattach. To remove the package from the PCB/Flexi cable, heat the solder joints above liquidus temperature. Bake the board at 125°C for 4 hours prior to rework to remove moisture that may crack the PCB or causing delamination. Use a thermal heating profile to remove a package that is close to the profile that mounts the package. Clean the site to remove any excess solder and residue to prepare for installing a new package. Use a mini stencil (localized stencil) to apply solder paste to the land pattern. In case a mini stencil cannot be used because of spacing or other reasons, apply solder paste on the package pads directly, then mount, and reflow.