ZHCSE82B June   2015  – October 2015 OPT8241

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Optical Characteristics
    9. 6.9 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Block
        1. 7.3.1.1 Serializer and LVDS Output Interface
        2. 7.3.1.2 Parallel CMOS Output Interface
      2. 7.3.2 Temperature Sensor
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Presence Detection for Industrial Safety
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Frequencies of Operation
          2. 8.2.1.2.2 Number of Sub-Frames and Quads
          3. 8.2.1.2.3 Field of View (FoV)
          4. 8.2.1.2.4 Lens
          5. 8.2.1.2.5 Integration Duty Cycle
          6. 8.2.1.2.6 Design Summary
        3. 8.2.1.3 Application Curve
      2. 8.2.2 People Counting and Locating
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Frequencies of Operation
          2. 8.2.2.2.2 Number of Sub-Frames and Quads
          3. 8.2.2.2.3 Field of View (FoV)
          4. 8.2.2.2.4 Lens
          5. 8.2.2.2.5 Integration Duty Cycle
          6. 8.2.2.2.6 Design Summary
        3. 8.2.2.3 Application Curve
      3. 8.2.3 People Locating and Identification
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
          1. 8.2.3.2.1 Frequencies of Operation
          2. 8.2.3.2.2 Number of Sub-Frames and Quads
          3. 8.2.3.2.3 Field of View (FoV)
          4. 8.2.3.2.4 Lens
          5. 8.2.3.2.5 Integration Duty Cycle
          6. 8.2.3.2.6 Design Summary
        3. 8.2.3.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 MIX Supply Decapacitors
      2. 10.1.2 LVDS Transmitters
      3. 10.1.3 Optical Centering
      4. 10.1.4 Image Orientation
      5. 10.1.5 Thermal Considerations
    2. 10.2 Layout Example
    3. 10.3 Mechanical Assembly Guidelines
      1. 10.3.1 Board-Level Reliability
      2. 10.3.2 Handling
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 文档支持

11.1.1 相关文档

《OPT9221 数据表》,SBAS703

《飞行时间 (ToF) 系统设计简介》SBAU219

11.2 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 商标

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 静电放电警告

esds-image

ESD 可能会损坏该集成电路。米6体育平台手机版_好二三四 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。

11.5 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.