ZHCSE82B June   2015  – October 2015 OPT8241

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Optical Characteristics
    9. 6.9 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Block
        1. 7.3.1.1 Serializer and LVDS Output Interface
        2. 7.3.1.2 Parallel CMOS Output Interface
      2. 7.3.2 Temperature Sensor
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Presence Detection for Industrial Safety
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Frequencies of Operation
          2. 8.2.1.2.2 Number of Sub-Frames and Quads
          3. 8.2.1.2.3 Field of View (FoV)
          4. 8.2.1.2.4 Lens
          5. 8.2.1.2.5 Integration Duty Cycle
          6. 8.2.1.2.6 Design Summary
        3. 8.2.1.3 Application Curve
      2. 8.2.2 People Counting and Locating
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Frequencies of Operation
          2. 8.2.2.2.2 Number of Sub-Frames and Quads
          3. 8.2.2.2.3 Field of View (FoV)
          4. 8.2.2.2.4 Lens
          5. 8.2.2.2.5 Integration Duty Cycle
          6. 8.2.2.2.6 Design Summary
        3. 8.2.2.3 Application Curve
      3. 8.2.3 People Locating and Identification
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
          1. 8.2.3.2.1 Frequencies of Operation
          2. 8.2.3.2.2 Number of Sub-Frames and Quads
          3. 8.2.3.2.3 Field of View (FoV)
          4. 8.2.3.2.4 Lens
          5. 8.2.3.2.5 Integration Duty Cycle
          6. 8.2.3.2.6 Design Summary
        3. 8.2.3.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 MIX Supply Decapacitors
      2. 10.1.2 LVDS Transmitters
      3. 10.1.3 Optical Centering
      4. 10.1.4 Image Orientation
      5. 10.1.5 Thermal Considerations
    2. 10.2 Layout Example
    3. 10.3 Mechanical Assembly Guidelines
      1. 10.3.1 Board-Level Reliability
      2. 10.3.2 Handling
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9 Power Supply Recommendations

The sensor reset noise is sensitive to AVDDH and PVDD supplies. Therefore, linear regulators are recommended for supplying power to the AVDD and PVDD supplies. DC-DC regulators can be used to supply power to the rest of the supplies. Ripple voltage on the VMIX and the SUB_BIAS supplies must be kept at a minimum (< 50 mV) to minimize phase noise resulting from differences between quads. The VMIX regulator must have the bandwidth to supply surge current requirements within a short time of less than 10 µs after the integration period begins because VMIX currents have a pulsed profile.

There is no strict order for the power-on or -off sequence. The VMIX supplies are recommended to be turned on after all supplies have ramped to 90% of their respective values to avoid any power-up surges resulting from high VMIX currents in a non-reset device state.