ZHCSNI8J September   2006  – March 2021 PCA9534A

PRODUCTION DATA  

  1. 1 特性
  2. 2 说明
  3. 3 Revision History
  4. 4 Description (Continued)
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Resistance Characteristics
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Functional Block Diagram
    2. 9.2 Device Functional Modes
      1. 9.2.1 Power-On Reset
      2. 9.2.2 I/O Port
      3. 9.2.3 Interrupt Output ( INT)
        1. 9.2.3.1 Interrupt Errata
          1. 9.2.3.1.1 Description
          2. 9.2.3.1.2 System Impact
          3. 9.2.3.1.3 System Workaround
    3. 9.3 Programming
      1. 9.3.1 I2C Interface
      2. 9.3.2 Register Map
        1. 9.3.2.1 Device Address
        2. 9.3.2.2 Control Register And Command Byte
        3. 9.3.2.3 Register Descriptions
        4. 9.3.2.4 Bus Transactions
          1. 9.3.2.4.1 Writes
          2. 9.3.2.4.2 Reads
  10. 10Application Information Disclaimer
    1. 10.1 Application Information
      1. 10.1.1 Typical Application
        1. 10.1.1.1 Design Requirements
          1. 10.1.1.1.1 Minimizing ICC When The I/O Controls Leds
  11. 11Power Supply Recommendations
    1. 11.1 Power-On Reset Requirements
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 静电放电警告
    3. 12.3 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Resistance Characteristics

THERMAL METRIC(1) PCA9535 UNIT
DB
(SSOP)		 DBQ
(SSOP)		 DVG
(TVSOP)		 DW
(SOIC)		 PW
(TSSOP)		 RGT
(VQFN)		 RVE
(VQFN)
16 Pins 16 Pins 16 Pins 16 Pins 16 Pins 16 Pins 16 Pins
R θJA Junction-to-ambient thermal resistance 82 90 86 92.2 122 63.2 51 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.
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