ZHCSNI9K August   2005  – March 2021 PCA9535

PRODUCTION DATA  

  1. 1 特性
  2. 2 说明
  3. 3 Revision History
  4. 4 Description Continued
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Resistance Characteristics
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
    1.     16
  8. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Device Functional Modes
      1. 8.2.1 Power-On Reset
      2. 8.2.2 I/O Port
      3. 8.2.3 Interrupt ( INT) Output
        1. 8.2.3.1 Interrupt Errata
          1.        24
          2.        25
          3.        26
    3. 8.3 Programming
      1. 8.3.1 I2C Interface
      2. 8.3.2 Register Map
        1. 8.3.2.1 Device Address
        2. 8.3.2.2 Control Register And Command Byte
        3. 8.3.2.3 Register Descriptions
        4. 8.3.2.4 Bus Transactions
          1. 8.3.2.4.1 Writes
          2. 8.3.2.4.2 Reads
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Minimizing ICC When I/O Is Used To Control Led
  10. 10Power Supply Recommendations
    1. 10.1 Power-On Reset Requirements
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Resistance Characteristics

THERMAL METRIC(1) PCA9535 UNIT
DB
(SSOP)		 DBQ
(SSOP)		 DVG
(TVSOP)		 DW
(SOIC)		 PW
(TSSOP)		 RGV
(VQFN)
16 PINS 16 PINS 16 PINS 16 PINS 16 PINS 16 PINS °C/W
R θJA Junction-to-ambient thermal resistance 92.9 61 86 108.8 48.4 43.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |