ZHCSNJ1H August   2005  – March 2021 PCA9539

PRODUCTION DATA  

  1. 1 特性
  2. 2 说明
  3. 3 Revision History
  4. 4 Description (Continued)
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Resistance Characteristics
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 RESET Timing Requirements
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Device Functional Modes
      1. 8.2.1 RESET Input
        1. 8.2.1.1 RESET Errata
          1. 8.2.1.1.1 System Impact
          2. 8.2.1.1.2 System Workaround
      2. 8.2.2 Power-On Reset
      3. 8.2.3 I/O Port
      4. 8.2.4 Interrupt ( INT) Output
        1. 8.2.4.1 Interrupt Errata
          1. 8.2.4.1.1 System Impact
          2. 8.2.4.1.2 System Workaround
    3. 8.3 Programming
      1. 8.3.1 I2C Interface
      2. 8.3.2 Register Map
        1. 8.3.2.1 Device Address
        2. 8.3.2.2 Control Register And Command Byte
        3. 8.3.2.3 Register Descriptions
        4. 8.3.2.4 Bus Transactions
          1. 8.3.2.4.1 Writes
          2. 8.3.2.4.2 Reads
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Detailed Design Procedure
        1. 9.2.1.1 Minimizing ICC When I/O Is Used To Control Led
  10. 10Power Supply Recommendations
    1. 10.1 Power-On Reset Requirements
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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11.2 Electrostatic Discharge Caution

GUID-E1FAB4ED-71A6-4709-A050-639163E0B6D8-low.jpg This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
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