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ZHCSK60G October 2005 – March 2021 PCA9544A

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		PCA9544A				UNIT
		DGV	DW	PW	RGY
		20 PINS	20 PINS	20 PINS	20 PINS
R_θJA	Junction-to-ambient thermal resistance	92	58	118.2	62.7	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	43.9	41.9	62.7	60.5	°C/W
R_θJB	Junction-to-board thermal resistance	64.5	40.3	69.3	39.5	°C/W
ψ_JT	Junction-to-top characterization parameter	4.2	18.1	7.7	7.2	°C/W
ψ_JB	Junction-to-board characterization parameter	63.6	40	68.8	39.8	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	n/a	n/a	n/a	26.6	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.