ZHCSNJ2D July   2006  – March 2021 PCA9554

PRODUCTION DATA  

  1. 1 特性
  2. 2 说明
  3. 3 Revision History
  4. 4 Description (Continued)
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Device Functional Modes
      1. 8.2.1 Power-On Reset
      2. 8.2.2 I/O Port
      3. 8.2.3 Interrupt Output ( INT)
        1. 8.2.3.1 Interrupt Errata
          1.        23
          2. 8.2.3.1.1 24
          3. 8.2.3.1.2 25
    3. 8.3 Programming
      1. 8.3.1 I2C Interface
      2. 8.3.2 Register Map
        1. 8.3.2.1 Device Address
        2. 8.3.2.2 Control Register And Command Byte
        3. 8.3.2.3 Register Descriptions
        4. 8.3.2.4 Bus Transactions
          1. 8.3.2.4.1 Writes
          2. 8.3.2.4.2 Reads
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
      1. 9.1.1 Typical Application
        1. 9.1.1.1 Design Requirements
          1. 9.1.1.1.1 Minimizing ICC When I/Os Control Leds
  10. 10Power Supply Recommendations
    1. 10.1 Power-On Reset Requirements
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) PCA9538 UNIT
DB
(SSOP)		 DBQ
(SSOP)		 DGV
(TVSOP)		 DW
(SOIC)		 PW
(TSSOP)
16 PINS 16 PINS 16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 113.2 121.7 120 57 63.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.
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