ZHCSHU7J August   2005  – March 2021 PCA9555

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Features
      1. 8.3.1 Power-On Reset (POR)
      2. 8.3.2 I/O Port
    4. 8.4 Device Functional Modes
      1. 8.4.1 Interrupt ( INT) Output
        1. 8.4.1.1 Interrupt Errata
          1. 8.4.1.1.1 INT Description
          2. 8.4.1.1.2 System Impact
          3. 8.4.1.1.3 System Workaround
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
      2. 8.5.2 Register Map
        1. 8.5.2.1 Device Address
        2. 8.5.2.2 Control Register And Command Byte
        3. 8.5.2.3 Register Descriptions
        4. 8.5.2.4 Bus Transactions
          1. 8.5.2.4.1 Writes
          2. 8.5.2.4.2 Reads
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
      1. 9.1.1 Typical Application
        1. 9.1.1.1 Design Requirements
        2. 9.1.1.2 Design Requirements
          1. 9.1.1.2.1 Minimizing ICC When I/O Is Used To Control Led
        3. 9.1.1.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power-On Reset Requirements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
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12.4 Electrostatic Discharge Caution

GUID-E1FAB4ED-71A6-4709-A050-639163E0B6D8-low.jpg This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
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