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ZHCSX36K July 2001 – September 2024 PCF8574

PRODUCTION DATA

5.4 Thermal Information

THERMAL METRIC ⁽¹⁾		PCF8574						UNIT
		DGV	DW	N	PW	RGT	RGY
		20 PINS	16 PINS	16 PINS	20 PINS	16 PINS	20 PINS
R_θJA	Junction-to-ambient thermal resistance	92	76.7	73.1	94.8	56.0	52.2	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	-	45.1	51.9	40.2	67.4	50.6	°C/W
R_θJB	Junction-to-board thermal resistance	-	45.8	48.3	58.5	31.2	29.2	°C/W
ψ_JT	Junction-to-top characterization parameter	-	17.2	29.8	2.8	3.9	3.3	°C/W
ψ_JB	Junction-to-board characterization parameter	-	45.2	47.9	58.0	31.1	29.1	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	-	n/a	n/a	n/a	15.1	16.0	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.