ZHCSIO3I
January 2005 – August 2024
PCF8575
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
I2C Interface Timing Requirements
5.7
Switching Characteristics
6
Typical Characteristics
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
I2C Interface
8.3.2
Interface Definition
8.3.3
Address Reference
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.1.1
Minimizing ICC When I/Os Control LEDs
9.2.2
Detailed Design Procedure
9.2.3
Application Curves
9.3
Power Supply Recommendations
9.3.1
Power-On Reset
9.3.2
System Impact
9.4
Layout
9.4.1
Layout Guidelines
9.4.2
Layout Example
10
Device and Documentation Support
10.1
Device Support
10.2
Documentation Support
10.3
接收文档更新通知
10.4
支持资源
10.5
Trademarks
10.6
静电放电警告
10.7
术语表
11
Revision History
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
DGV|24
MPDS006C
PW|24
MPDS363A
RGE|24
MPQF124G
DBQ|24
MPDS211A
DW|24
MPDS174A
DB|24
MPDS509
散热焊盘机械数据 (封装 | 引脚)
RGE|24
QFND024AD
订购信息
zhcsio3i_oa
zhcsio3i_pm
8.3.2
Interface Definition
BYTE
BIT
7 (MSB)
6
5
4
3
2
1
0 (LSB)
I
2
C target address
L
H
L
L
A2
A1
A0
R/
W
P0x I/O data bus
P07
P06
P05
P04
P03
P02
P01
P00
P1x I/O data bus
P17
P16
P15
P14
P13
P12
P11
P10
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