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ZHCSIO3I January 2005 – August 2024 PCF8575

PRODUCTION DATA

5.4 Thermal Information

THERMAL METRIC ⁽¹⁾		PCF8575						UNIT
		DB	DBQ	DGV	DW	PW	RGE
		24 PINS
R_θJA	Junction-to-ambient thermal resistance	87.8	61	86	75.6	99.7	53.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	51.9			47.9	42.5	50.8	°C/W
R_θJB	Junction-to-board thermal resistance	56.8			50.1	66.1	31.5	°C/W
Ψ_JT	Junction-to-top characterization parameter	14.3			21.1	2.7	3.4	°C/W
Ψ_JB	Junction-to-board characterization parameter	56.2			49.7	65.5	31.4	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	-			-	-	14.8	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.